Boyd

Overview

Boyd Corporation is a thermal management and engineered materials company that designs and manufactures cooling solutions, sealing systems, and other precision components for demanding thermal environments. Boyd serves industries including automotive, aerospace, medical, and data center infrastructure, bringing deep expertise in heat dissipation and fluid management.

In the data center facility space, Boyd's role at the 2025 OCP Global Summit centered on the rack emulator -- a standardized test fixture that simulates the thermal and hydraulic loads of production IT racks. Boyd manufactured both the proof of concept and production units of the OCP rack emulator, which was demonstrated at the summit's OCP booth C18. The rack emulator is a critical tool for validating data center cooling infrastructure (CDUs, piping, and TCS loops) without requiring live GPU hardware, enabling facility operators to commission and test cooling systems ahead of IT equipment deployment.