Ganesh Srinivasan

Overview

Ganesh Srinivasan is Vice President of Product Management for AI Cloud & Enterprise at TE Connectivity. He leads the product portfolio covering TE's co-packaged copper (CPC), orthogonal through-board (OTB), cable cartridge/backplane, power bus bar, and liquid-cooled I/O connector lines targeting next-generation high-density AI racks. At OCP Global Summit 2025, Srinivasan presented the product-level details of TE's end-to-end signal, power, and thermal solutions, including the CPC's 110×110mm substrate with 1,024 differential pairs and the liquid-cooled bus bar first-to-market achievement.