High-Voltage Connectivity, Power & Cooling for the AI Data Center

Author: Stephanie Moser, Head of Power Solutions, Digital Data Networks Business Unit, TE Connectivity Collection: 2025 OCP Global Summit - Expo Hall Sessions

Summary

TE Connectivity presents its "whip to chip" power connectivity portfolio for AI data centers, addressing the evolution from HPR v1/v2 (up to 200 kW, power/GPU/CPU in single rack) through HPRv3 Side Power Rack (approximately 300 kW, separate power and compute racks at 50V) to HPRv4 High Voltage Rack (over 1 MW at +/-400V or 800V, with sidecar power). The presentation focuses on two major product categories: rack-to-rack power delivery solutions and board-level high-power connectors.

For the sidecar rack architecture, TE offers a horizontal rack-to-rack busbar carrying over 500A in 1U with flexible tube design using the BB2000 busbar connector (in mass production, global availability Q1 2026), and a liquid-cooled busbar in ORv3-compatible configurations at 400 kW, 750 kW, and over 1 MW at 50V, delivering up to 5x more current capacity versus same-form-factor air-cooled alternatives (sampling now, mass production Q1 2026). For HVDC architectures supporting 8x more GPUs per rack at over 1 MW, TE provides an end-to-end solution spanning AC input, powershelf AC input, PSU AC input and DC output, power shelf DC output, vertical triple busbar, R2R HV cable/busbar, and HVDC IT gear input.

At the board level, TE is the lead OCP design partner for the new 48V PICPWR power connector. The Multi-Beam Pro delivers 195A per contact in standard height factor. Pin & Socket solutions (Iccon and Rapid Lock Assemblies) provide over 350A per pin for board-to-board and cable-to-board. The Elcon Mini delivers approximately 40A per contact in a similar form factor to MPIC. Overall, TE claims to be expanding current ratings by more than 2x in the same form factors.