How Will Copper Drive High-Speed Interconnect Solutions Fueling Next-Generation AI Data Centers

Author: Hendra Holdensro, BizLink Group Collection: 2025 OCP Global Summit - Expo Hall Sessions

Summary

BizLink Group presents comprehensive R&D results on pushing copper interconnect performance toward 448 Gbps per lane and beyond, demonstrating that copper remains viable for next-generation AI data center interconnects through advances in cable gauge miniaturization (down to 39 AWG), higher bandwidth designs (past 100 GHz), co-packaged copper solutions, PFAS-free materials, and even space-rated cables. The presentation analyzes three coding options for 448 Gbps: PAM 4 (112 GHz Nyquist, 224 GBd), PAM 6 (87 GHz Nyquist, 173 GBd, -4.4 dB SNR vs PAM 4), and PAM 8 (75 GHz Nyquist, 150 GBd, -7.4 dB SNR vs PAM 4), with the industry coding decision still open.

Key measurement results include: 30 AWG cable achieving suck-out-free performance to approximately 110 GHz with insertion loss of 13.5 dB/m at 75 GHz and 14.9 dB/m at 87 GHz (at 92 ohms). BizLink developed a high-precision measurement system with 1 mm coax connectors achieving fixture return loss less than -10 dB, enabling reproducible characterization to 110+ GHz. Miniaturization advances include 34 and 36 AWG cables with optimized insertion loss of 12.7 dB/m at 24 GHz for 85 ohm PCA6 designs, and 39 AWG cables for co-packaged copper (CPC) applications partnered with Rosenberger's TeraNano connector (10 mm x 18 mm, 32 differential pairs, <6 mm mating height, 60 GHz bandwidth). BizLink also demonstrated a PFAS-free cable alternative that actually shows better insertion loss than traditional FEP-insulated cables, and a space-rated 26 AWG cable with TML under 0.5% and CVCM under 0.01%.