Liquid Cooling for Data Centers

Overview

Liquid cooling for data centers encompasses technologies that transfer heat from server components directly to a liquid coolant, enabling rack densities far beyond what air cooling can support. Delta's portfolio spans three scopes: board-level (cold plates for CPU/GPU/memory hotspots), rack-level (in-rack CDUs, both liquid-to-liquid and liquid-to-air), and system-level (full rack manifold assembly).

Cold plate designs scale with chip power density: embedded tube in aluminum/copper base handles <20 W/cm² (TDP <20 W/cm²); cross-flow fin channels handle <70 W/cm² and TDPs below 2 kW; impingement flow handles <100 W/cm² and TDPs below 2.8 kW; 0.1 mm fin-pitch micro-channel designs with optional vapor chamber handle >100 W/cm² and chip TDPs up to 3.6 kW.

Delta's in-rack CDU product line progresses from 22 kW (2023) through 60 kW (June 2025), 140 kW (September 2025), 250 kW liquid-to-liquid (Q1 2026), and a 24 kW liquid-to-air unit (December 2025). For in-row deployment, a 1.5 MW stacked unit (six 250 kW CDUs) launches Q1 2026; a native 2.4 MW 800 VDC liquid-to-liquid in-row CDU with an in-house DC pump running directly on 800 VDC launches Q3 2026.