Pranav Garg

Overview

Pranav Garg is Vice President of Strategy, Business Development, and Marketing at TE Connectivity, where he leads market positioning for TE's AI data center interconnect portfolio. He is associated with TE's thesis that the "interconnect wall" — not the memory wall — is the primary physical bottleneck in AI scaling, and presented TE's five-trend framework at OCP Global Summit 2025: GPU density escalation (36→72→144→288 GPUs per rack), data lane speed doubling every ~1.5 years, rack power scaling toward 1 MW, liquid cooling transitions, and the copper-optics coexistence paradigm.