Bill Brennan

Overview

Bill Brennan is President and CEO of Credo Semiconductor, a company specializing in high-speed connectivity silicon for AI clusters. He led the ZeroFlap initiative that began 18–24 months before the 2025 OCP Global Summit, when Credo recognized that back-end network reliability for AI clusters — specifically optical link flap — was the highest priority unsolved problem. Under Brennan's leadership, Credo introduced 800G ZeroFlap AECs at OCP 2024 (100M hours MTBF, 6 billion field hours without link flaps) and developed the full ZeroFlap optics architecture with five pillars: hardened optics, segment-by-segment DSP telemetry, fiber plant health telemetry, ESD detection, and in-band firmware updates. Brennan also committed to contributing the ZeroFlap host specification and host drivers to a new OCP Optics Reliability Project.