At the OCP Global Summit 2025, AMD presented its open-systems approach to AI data center networking, covering the three networking tiers (scale-up, scale-out, scale-across) required for million-GPU clusters. The talk detailed the AMD Pensando Pollara 400 AI NIC — currently shipping — and its P4-programmable architecture that delivers 25% RCCL performance improvement and 50% better job completion time under packet loss versus standard RoCEv2. AMD also introduced the next-generation Pensando Vulcano 800 Gbps NIC on 3nm with 8x GPU scale-out bandwidth, coming in 2026. Multi-plane networking was highlighted as a key TCO lever, reducing switch count by 40% for 100K GPU clusters.

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