E3 Form Factor

Overview

E3 is an established EDSFF form factor that saw spec extensions in 2025. The orthogonal EDSFF connector, previously E1-only, was extended to also support E2 and E3, enabling single-connector top-of-board topologies. E3 also gained liquid-cooling spec work: the E3 spec liquid-cooling effort was introduced shortly after the E1.S liquid-cooling project kicked off in September 2025, as part of accelerating the EDSFF cooling roadmap.