Expo Session Presented by Auras Technology

Author: Ethan Chen, Auras Technology Collection: 2025 OCP Global Summit - Expo Hall Sessions

Summary

Auras Technology presents its comprehensive liquid cooling solutions for AI data center infrastructure, covering cold plates, CDUs, rack manifolds, quick connectors, and complete thermal management systems. The company positions itself as a thermal solutions specialist tackling three challenges: semiconductor heat dissipation, energy resource efficiency, and water resource management. IDC projects global AI infrastructure investment reaching $90 billion by 2028 (double 2024 levels), while GPU TDP continues climbing from 350W to over 2.5 kW per GPU, with data centers projected to consume over 12% of total US power by 2030 (triple current levels).

Auras highlights that liquid cooling can reduce data center PUE close to 1.1, meaning most power goes directly to IT equipment. A comparison shows liquid cooling needing only one rack versus two for air cooling at the same computing power, saving approximately 31% in annual power cost. The company's cold plate technology roadmap progresses from sky-cut copper single-phase cooling (2,000-3,000W) to micro-channel lid designs with smaller fin pitch (over 4,000W) to wafer micro-channel two-phase cooling fabricated directly on silicon (over 5,000W future).

Product offerings include a 300 kW liquid-cooled PSU module operating at 45-degree ambient with 12 LPM flow, in-row RPU (100 kW cooling capacity with redundant pumps, fans, and power, hot-swappable, remote monitoring), in-row CDU (1.6 MW capacity with 1+1 redundancy, supporting multiple high-density racks), and a full ecosystem of rack manifolds, AI manifolds, quick connectors, DIM cold plates, and valve products.