Hardeep Singh

Overview

Hardeep Singh (referred to as "Hardi") is a thermal engineer at Solidigm who presented the physics of SSD liquid cooling at the 2025 OCP Global Summit. He showed that multiple current SSD form factors (E1.S 9.5mm, E1.S 15mm, E3.S) already require inlet air temperatures below the ASHRAE A2 35°C threshold at PCIe Gen 5 power levels (~25W), because SSDs have no active thermal solution of their own.

Singh developed Solidigm's innovative cold plate design that contacts either side of the SSD PCB and cools all components on both sides simultaneously. He also engineered the spring-activated hot-swap mechanism where the cold plate automatically engages on drive insertion and releases without stress on removal. His energy analysis using the PS1010 product line quantified ~100x cooling energy efficiency advantage for the liquid-cooled 9.5mm E1.S variant versus the air-cooled 15mm variant.