Empowering Software-defined Memory Solutions with Genuine CXL Pooling Technology

Author: Jinin So, Senior Director & System Architect, Samsung Semiconductor; Brian (CEO, H3 Platform); Geof Findley, VP Business Development and Sales, Montage Technology Collection: 2025 OCP Global Summit - Expo Hall Sessions

Summary

This three-company joint presentation showcases a production-ready CXL memory pooling solution combining Samsung's CMM-D (CXL Memory Module with DRAM) memory expanders, H3 Platform's Falcon C5022 CXL switch-based memory appliance, and Montage Technology's CXL Memory eXpander Controller (MXC) silicon. Samsung's DCMFM (Data Center Memory Fabric Manager) software orchestrates dynamic memory allocation/deallocation integrated with Kubernetes, addressing the critical problem that only 23% of provisioned memory and 10% of provisioned CPUs are actually utilized in cloud clusters (per cast.ai 2025 Kubernetes Cost Benchmark Report).

The CXL switch-based memory pooling demonstrated 4.6x throughput improvement and 82% tail latency reduction for in-memory databases compared to InfiniBand-based pooling, and 6x throughput improvement versus RoCEv2. H3 Platform's Falcon C5022 is a 3U CXL 2.0 memory sharing/pooling system holding up to 20 E3.2T memory modules (up to 5.0 TB capacity, with 256 GB per module currently available), connected to four host servers via CDFP cables. Live benchmarks showed 121 GB/s aggregate bandwidth and 210 million IOPS from a single switch across four GNR (Granite Rapids) servers each receiving 1 TB of CXL memory. This solution went into CSP production the month before the presentation.

Samsung's CMM-D roadmap spans from CMM-D 1.1 (industry's first 512 GB CXL, 2024) through CMM-D 2.0 (commercialization phase, 2025) to CMM-D 3.1 (1 TB capacity with compression, PNM engine, DCD/peer-to-peer, CXL 3.1 + PCIe Gen 6, targeting 2027). Montage is sampling CXL 3.1 controllers and shipping PCIe Gen 6 retimers in volume, positioning as the controller vendor of choice used by Samsung, SK Hynix, and Micron.

Sign in to read the full article.

Sign In