Customer-Driven Advancements in Power And Cabinet Infrastructure

Author: Calvin Nicholson & Swen Anderson, Legrand Collection: 2025 OCP Global Summit - Expo Hall Sessions

Summary

Legrand presents its data center white space product suite spanning Starline busway, power distribution, cabinet PDUs, OCP-compatible cabinets, and OCP power shelves. The T-series cabinet platform features a tubular welded frame design with 5,000 lbs static load and 3,500 lbs dynamic load capacity, fully customizable for OCP and NVIDIA MGX rack specifications. Legrand is already producing MGX-compatible rack cabinets at large scale for major US data centers and is beginning European production in early 2026.

The OV3-compatible DC bus bars are offered in three amperages -- 350-400A (for existing 18 kW shelves), 700A (for the new 33 kW shelf), and a 1,400A prototype targeting MGX approval. The bus bars use a roll-forming production process (borrowed from Starline power overhead busway technology) that is lower cost than copper extrusion and enables easy embedding of active cooling technology. An actively cooled DC bus bar is in the design stage for release by end of 2025. The power shelf incorporates unique features including integral monitored/switched AC outlets (effectively embedding a high-accuracy AC PDU for non-DC devices like network switches), a comprehensive sensor suite (temperature, humidity, water, vibration -- about 20 sensors), waveform capture for overcurrent troubleshooting, and the Xerus EX-12 network controller card (dual Gigabit Ethernet with PoE, USB, sensor ports, local display). The firmware stack, originally developed with AMD in 2010 as a BMC stack, provides full Redfish compatibility, REST APIs, SNMP, SDK, and upcoming MCP (Model Context Protocol) support for LLM agent interaction.