OCP SSD Test Panel

An OCP Global Summit panel, moderated by Microsoft's Lee Puit, in which two test-tool vendors -- Rick Walsh (Senior VP, Sanblaze) and Nick Krosinski (VP of Products and Services, Austin Labs / Teledyne LeCroy) -- explain how OCP NVMe SSD compliance test suites let drive vendors 'shift left' and catch defects early in development rather than in the data center. The vendors cover their platforms, the test suite's scope and timing, ADP parameter files and compliance modes, FPGA pre-silicon testing, and what's new in OCP 2.6. A Q&A covers OCP's spec contribution/CLA process and the roughly 90-day lead time between a new spec and a matching test suite.

Key Takeaways

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