Data Center One-Stop Liquid Cooling Solution Presented by TCT

Author: Barry, Sales VP, TCT (Thermal Control Technology) Collection: 2025 OCP Global Summit - Expo Hall Sessions

Summary

TCT (Thermal Control Technology), founded in 2018 and headquartered in Dongguan, China, presents its full-stack liquid cooling solution portfolio spanning component-level products (cold plates, QDs, valves) through module-level products (manifolds, rear-door heat exchangers, rack-based CDUs) to floor-based CDUs and secondary cooling networks. The company operates from manufacturing facilities in southern China with globalization underway: a new Penang, Malaysia factory, a planned 50,000 sqm China headquarters, a Taipei trail-run factory under construction, and a future Texas, USA facility.

TCT's CDU product line includes compact 350 kW edge units, hyperscale units up to 2 MW capacity with approach temperatures of 3 degrees, and the RC125 described as the most powerful rack-based CDU on the market. Rack-based CDUs range from 6 kW to 200 kW capacity with 5-degree approach temperatures, serving lab and entry-level deployments. The company manufactures cold plates for NVIDIA B-series and GB-series as well as Intel and AMD CPUs, including DIMM/memory module, switch, light pipe cage, QSFP, and OSFP cold plates, plus Cisco switch solutions. Additional products include liquid leak detection systems (testers, row-level with cold plate, and PCB-based solutions) and thermal test vehicles (TTVs) for CDU testing and specification validation. TCT has a compatible product with the OCP ORv3 standard (referenced as "DOS 40 FD83").