Next-Generation Co-Packaged Optics Systems

Author: Jason (Jabil, systems background); Kish (Marvell, silicon background) Collection: 2025-OCP-Global-Summit-Networking

Summary

This presentation describes the first collaborative co-packaged optics (CPO) switch system jointly designed and built by Marvell and Jabil, currently being demonstrated on the OCP 2025 show floor. The system follows Open Rack v3 (ORV3) mechanical and thermal specifications, uses the Marvell Teralynx switch ASIC family combined with a previously announced Marvell 6.4T optical engine, and achieves up to 102.4 Tbps of front-panel bandwidth in a 10U form factor with 16 ELSFP ports and 64 SN-MT (Senko) connectors.

The design uses a modular midplane fiber connector approach to separate the mainboard PCB from the front-board PCB, enabling independent manufacturing, field repair of individual optical elements without full system disassembly, and high manufacturing yield. Cooling is hybrid — air-cooled lasers (which "have the best seat in the house" at the cold aisle) with optional cold-plate capability for fully liquid-cooled environments. The control plane uses a Portwell COM-E x86 module with an optional BMC for out-of-band management. Three key lessons: building to 1OU form factor is extremely difficult and requires substantial liquid cooling expertise; design for manufacturability (DFM) must be a product requirement from day one; CPO requires a village — system vendors, silicon vendors, fiber manufacturers, PCB vendors, and component suppliers must collaborate early.