This OCP Global Summit 2025 session from Solidigm and Iceotope argues that liquid cooling for SSDs is no longer optional — PCIe Gen 5 SSDs already strain air cooling limits, and PCIe Gen 7 devices projecting 60-70W will make air cooling impossible. Solidigm presents engineering solutions for hot-swap cold plate integration and dual-sided PCB cooling, while Iceotope demonstrates its precision immersion dielectric fluid approach achieving up to 950+ kW per rack. The session concludes with a call for new industry standards, noting a Solidigm-led draft specification is under SNIA review.

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