Modular Hardware System
Overview
The Modular Hardware System (MHS, also DC-MHS) is an OCP standard that defines a three-layer modular server architecture with independently replaceable building blocks:
- HPM Components (Host Platform Module — the motherboard layer): CPU socket options including AMD SP5, AMD SP8, Intel SP BHS, Intel SP OKS, SP7 (Arm-based), Ampere, plus BMC/DC-SCM management modules.
- Rear Chassis: FLW (Front-Loading Workstation), SDNO (Software-Defined Network Optimized), ORv3 2-OU, ORv3 1-OU.
- Front Chassis (I/O): U.2, E3.S, GPU/AI, E1.S storage and accelerator configurations.
The standard enables customers to mix and match components across layers — selecting CPU architecture, chassis form factor, and front-end storage/GPU type — without redesigning the full server. Standard interface points ensure cross-vendor interoperability, and pre-tested, validated modules reduce development and validation cycles. This is the technical backbone of the OCP Building Block Strategy.
MHS is developed within the OCP community; Jabil sits on the OCP MHS design board and uses the taxonomy as the organizing framework for its commercial building-block catalog.
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