Immersion Solutions: A Systems-Level Approach to Cooling at Scale

Author: Amy Short, PhD (Denvr Dataworks); Kevin Gero (Murata); Andy Young, PhD (Asperitas); Oriol Chavanel (Submer); Mick Jones (Vertiv); Adrian Kiessling (Wieland) Collection: 2025-OCP-EMEA-Summit-Immersion-Cooling

Summary

This session is a coordinated report-out from the five workstream leads of the OCP Immersion Solutions Technical Committee, presented at the 2025 OCP EMEA Summit in Dublin (29–30 April). The committee functions as the "final mile" for integrating all aspects of immersion cooling at the data center deployment level, spanning financial justification through long-term operational best practices. With 251 members and significant industry diversity — 40% from fluid chemistry, 14% ITE OEM/ODM/Integrator/Supply, 14% supply chain/component suppliers, 13% solution vendors, 7% certification/research/association/Govt, 4% facility design/build/supply, 4% end user, 4% consulting — the group aims to produce specifications, models, and guardrails that enable widespread immersion adoption.

Each of the five workstreams — Total Cost of Ownership (TCO), Power Distribution, Immersion Requirements, Hardware Management, and FMEA — presented their current status and near-term deliverables. The TCO model (v1.1) is now available on the OCP marketplace and supports configurable data center room/cluster/rack modeling across air, rear-door heat exchanger, direct-to-chip, and immersion modalities. The Power Distribution workstream is in final revision on its ORv3 Base Spec for single-phase immersion environments, with published data showing ORv3 connectors carrying 107% of rated capacity in immersion vs. 70% in 400 LFM airflow at 30°C T-rise, and bus bars and power shelves sustaining approximately 3x the load compared to air-cooled equivalents per transcript testimony. The Immersion Requirements workstream — the community's largest at 125 members — is revising its requirements document and building a new path to OCP Marketplace product approvals. Hardware Management has completed DMTF Redfish schema coverage for CDUs and is building interoperability profiles for all OCP liquid-cooled device types. FMEA is newly formed and soliciting input to prioritize its de-risking framework across component, system, and facility levels.

An acknowledgment slide (Image 12, 14:55) identifies over 30 contributing organizations, including Denvr Dataworks, Murata, Asperitas, Microsoft, Vertiv, Submer, Wieland, Lubrizol, Unicom, UL, Intel, Promersion, Super Micro, nVent, Schneider Electric, Advanced Energy, HF Sinclair, Lanxess, GRC, Fuchs, Micron, Molex, FIT, Hewlett Packard Enterprise, Cargill, Amphenol, Oleon, Soltex, Great Wall, BP, Chevron Phillips Chemical, TE, Iceotope, Liteon, and Valvoline.